OPAL-MD - Multi-die automated test station

Accurate, automated, fast testing of photonic integrated circuits (PIC) with traceable results.

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Características principales

Multi-die PIC characterization in one single execution
Flexible design with reconfigurable probes
Single software suite for preparation, execution and analysis of PIC test data
Operates with EXFO optical component tester and other test equipment
Ultra-precise optical heads – ideal for surface and edge-coupling
Precise DC and RF probing positioners

Aplicaciones

Optical and electrical probing and testing of integrated photonics on multiple dies
Opto-electronic testing on any integrated photonic platforms: silicon photonics, indium phosphide, III-V, polymer, heterogeneous, etc.
Application-agnostic: telecom & datacom transceivers, quantum, LIDAR, sensors, AI, etc.
Pilot production
Design and process validation
MPW die verification

Recursos

Todos los recursos
Blog
Challenges of integrated photonics: testing high-precision microring resonators - Español (noviembre 25, 2024)
Folletos y catálogos
Optical testing solutions for universities and labs - English (diciembre 23, 2024)
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OPAL-SD - single-die testing - English (junio 19, 2025)
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OPAL-SD - single-die testing - Français (junio 19, 2025)
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OPAL-SD - single-die testing - 中文 (junio 19, 2025)
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OPAL-EC: edge-coupling wafer-level test station - English (junio 19, 2025)
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OPAL-EC: edge-coupling wafer-level test station - Français (junio 19, 2025)
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OPAL-EC: edge-coupling wafer-level test station - 中文 (junio 19, 2025)
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OPAL-EC: edge-coupling wafer-level test station - 日本語 (junio 19, 2025)
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OPAL-MD – multi-die test station - English (junio 27, 2025)
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OPAL-MD – multi-die test station - Français (junio 27, 2025)
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OPAL-MD – multi-die test station - 中文 (junio 27, 2025)

Asistencia

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